What makes these chips smart
We harness the latest breakthroughs in quantum computing through state-of-the-art chips — leveraging advanced packaging that goes far beyond the limits of classical computing.
Quantum capability, engineered into silicon
In a world where technology is advancing at an unprecedented pace, Smartkoy is dedicated to advancing quantum wafer fabrication. Our state-of-the-art chips are engineered to deliver capabilities that go far beyond the limits of classical computing.
As a pure-play foundry, we focus entirely on doing one thing exceptionally well: producing high-quality 300mm quantum wafers.
From substrate to smart chip
- 01
300mm Quantum Wafers
A pure-play foundry dedicated entirely to producing 300mm quantum wafers — the substrate on which the next generation of quantum hardware is built.
- 02
Through-Silicon Vias (TSV)
Vertical interconnects pass directly through the silicon, enabling dense, high-performance 3D integration that classical packaging cannot match.
- 03
Wafer-Scale Bumping
Advanced bumping across the full wafer delivers the interconnect density and reliability required for production-grade quantum devices.
- 04
In-Line Testing & Characterization
Every wafer is measured throughout fabrication, surfacing the data partners need to refine designs with confidence.
- 05
Process Design Kits (PDKs)
Dedicated PDKs give design teams a head start, accelerating development and dramatically shortening iteration cycles.